APSC Mains Enrichment Notes
The Union Cabinet on August 12 approved four major semiconductor projects across Odisha, Punjab, and Andhra Pradesh under the Semicon India Programme. This comes after Assam began work on its first semiconductor facility in Jagiroad, expected to be operational by late 2025, positioning the Northeast as part of India’s emerging technology hub.
In Odisha, two major projects have been sanctioned. SiCsem Pvt Ltd will establish a silicon carbide semiconductor plant in Bhubaneswar with an investment of ₹2,067 crore, while 3D Glass Inc. will develop a 3D glass manufacturing unit with ₹1,944 crore investment, backed by global players like Intel and Lockheed Martin. Andhra Pradesh will see the setting up of a chip packaging facility by Advanced System in Package Technologies Pvt Ltd with an investment of ₹469 crore. Punjab will host a semiconductor facility by Continental Device India Ltd (CDIL), with an investment of ₹118 crore.
These projects mark a strategic push to reduce India’s dependence on semiconductor imports and strengthen its domestic capacity in design, manufacturing, and packaging. Together with the upcoming Jagiroad facility in Assam, they form part of a broader effort to make India a significant player in the global semiconductor ecosystem, aligning with the vision of technological self-reliance under Aatmanirbhar Bharat.
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